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08:30-09:30
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Registration + Tea/Coffee
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09:30 - 09:40
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Welcome Note and Context Setting
Sukhwan Moon, Area Vice President, Korea, Taiwan and ASEAN & ANZ, Ansys |
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09:40 - 10:00
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Ansys Corporate Keynote
Scott Davidson, VP Marketing, Ansys |
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10:00 - 10:15
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Industry Keynote
Hoo We Tak, DX Project Director, Hyundai Motor Group Innovation Center Singapore (HMGICS) |
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10:15 - 10:30
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Advancing Product Design and Innovation with Simulation-Driven Digital Engineering
Padmesh Mandloi, Regional VP - Customer Excellence APAC, Ansys |
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10:30 - 10:50
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Tea/Coffee + Networking + Technology Showcase
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10:50 - 11:05
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Industry Keynote
Rayner Ng Chun Piaw, Director, Innovation Factory, A*STAR SIMTech |
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11:05 - 11:20
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Industry Keynote
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11:20-11:40
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Engineering What's Ahead in Space & Defense
Shuzo Otani, Area Vice President Sales, Aerospace and Defense, APAC, Ansys |
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11:40 - 12:00
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Virtualization of Chip-Package Co-design for Shift Left in Product Development
Vamsi Krishna, Director- Customer Excellence, Ansys |
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12:00 - 12:15
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Industry Keynote: Simulation & Material characterization for Heterogeneous Integration
of Semiconductor Packaging
Dr. Lee Teck Kheng, Director of Technology Development Centre ITE College Central |
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12:15 - 13:15
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Lunch Break
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Product Track 1:
Fluids & Mechanical |
Product Track 2:
Electronics & Optics |
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13:15 - 13:30
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What's New in Ansys Fluids
Bakytzhan Akhmetov, Senior Application Engineer, Ansys |
What's New in Ansys Electronics
Hai Peng Tan, Principal Application Engineer, Ansys |
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13:30 - 13:45
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What's New in Ansys Mechnical
Dr. Yong Kin Yew, Technical Manager, CAD-IT Consultants (Asia) Pte Ltd |
What's New in Ansys Optics
Eric Cheung, Application Engineering- Optics and Photonics, CADFEM SEA Pte Ltd |
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Industry Track 1:
Defense, Mobility and Transportation |
Industry Track 2:
High-tech, Semiconductor and Electronics |
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13:45 - 14:05
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Electrification and Autonomy in Mobility
Shitalkumar Joshi, Senior Director, Ansys India-ASEAN |
Multi-Chiplet Heterogeneous Integration
for AI System in Package Dr. Surya Bhattacharya, Director, System in Package (SiP), A*Star Institute of Microelectronics (IME) |
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14:05 - 14:25
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NTU Satellite Design with ANSYS Simulation
Lee Chon Kiat, Mechanical Lead, NTU-SaRC |
Designing Next Generation RF Devices
with Ansys Multiphysics Flow Vamsi Krishna, Director- Customer Excellence, Ansys |
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14:25 - 14:45
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Digital Mission Engineering for
Multi-Domain Defense Systems Karynna Tuan, Manager Application Engineering, Ansys |
Thermomechanical Reliability of Electronics
from 2.5D/3D-ICs to Systems Bharat Panjawani, Lead Application Engineer, Ansys |
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14:45 - 15:00
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Tea/Coffee + Networking + Technology Showcase
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15:00 - 15:20
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Industry Presentation
Roshan Vijay, Head of Simulation-based Testing, Validation and Research, CETRAN |
Industry Presentation
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15:20 - 15:35
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Q&A
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Q&A
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15:35 - 15:40
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Concluding Remarks
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Concluding Remarks
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15:40 - 16:00
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Networking + Technology Showcase
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