Upcoming Event

Accelerating Product Design and Innovation with Digitalization and AI-led Simulation

Event Details:

Date:

October 3, 2024

Time:

8:30 am - 4:00 pm Singapore Time (SGT)

Venue:

Grand Copthorne Water front Hotel
392 Havelock Road, Singapore 169663

Overview:

Industries are undergoing a transformative shift towards sustainability and digitalization, driven by technological advancements in defense, aerospace, mobility, and electronics. This transformation, however, brings challenges such as increased product complexity, higher costs, and the need for faster, more reliable design cycles. Engineers now rely on simulation, virtual prototyping, and digitalization to overcome these challenges, making design decisions that balance innovation with cost control and reduced time to market. Join the Ansys Innovation Conference to explore these emerging trends and learn how AI-augmented simulation can speed up and enhance the product development process.

Benefits:

  • Accelerated Design and Innovation:
    Learn how digitalization and AI-led simulation are transforming product development.

  • Enhanced Accuracy:
    Discover how AI-augmented simulations offer faster, more accurate predictions.

  • Cost and Time Efficiency:
    Understand strategies to reduce costs and time to market without compromising on innovation.

  • Industry Insights:
    Gain knowledge from engineering leaders about emerging trends and best practices across multiple industries.

Focused Industries:

  • Defence, Aerospace,
  • Automotive & Transportation
  • High-tech, Semiconductor and Electronics

Who Should Attend:

  • R&D Engineers and Managers
  • Design Engineers and Managers
  • Product Development Engineers, Managers, and Heads
  • Quality Engineers and Managers
  • Researchers and Academia
  • Startups in the engineering and technology sectors

Key Discussion Topics:

  • Next-gen product innovation trends
  • Multiphysics – Mechanical, CFD, Thermal, Electromagnetics
  • Electronics reliability, EMI/EMC
  • Chip/Package/Board
  • Optics and Photonics
  • Industry 4.0 / IoT
  • Advanced simulation practices
  • AI/ML, Cloud, GPU computing
  • Digital twin, MBSE, Automation

Agenda:

08:30-09:30
Registration + Tea/Coffee
09:30 - 09:40
Welcome Note and Context Setting
Sukhwan Moon, Area Vice President, Korea, Taiwan and ASEAN & ANZ, Ansys
09:40 - 10:00
Ansys Corporate Keynote
Scott Davidson, VP Marketing, Ansys
10:00 - 10:15
Industry Keynote
Hoo We Tak, DX Project Director, Hyundai Motor Group Innovation Center Singapore (HMGICS)
10:15 - 10:30
Advancing Product Design and Innovation with Simulation-Driven Digital Engineering
Padmesh Mandloi, Regional VP - Customer Excellence APAC, Ansys
10:30 - 10:50
Tea/Coffee + Networking + Technology Showcase
10:50 - 11:05
Industry Keynote
Rayner Ng Chun Piaw, Director, Innovation Factory, A*STAR SIMTech
11:05 - 11:20
Industry Keynote
11:20-11:40
Engineering What's Ahead in Space & Defense
Shuzo Otani, Area Vice President Sales, Aerospace and Defense, APAC, Ansys
11:40 - 12:00
Virtualization of Chip-Package Co-design for Shift Left in Product Development
Vamsi Krishna, Director- Customer Excellence, Ansys
12:00 - 12:15
Industry Keynote: Simulation & Material characterization for Heterogeneous Integration of Semiconductor Packaging
Dr. Lee Teck Kheng, Director of Technology Development Centre ITE College Central
12:15 - 13:15
Lunch Break
Product Track 1:
Fluids & Mechanical
Product Track 2:
Electronics & Optics
13:15 - 13:30
What's New in Ansys Fluids
Bakytzhan Akhmetov,
Senior Application Engineer, Ansys
What's New in Ansys Electronics
Hai Peng Tan,
Principal Application Engineer, Ansys
13:30 - 13:45
What's New in Ansys Mechnical
Dr. Yong Kin Yew, Technical Manager,
CAD-IT Consultants (Asia) Pte Ltd
What's New in Ansys Optics
Eric Cheung, Application Engineering-
Optics and Photonics, CADFEM SEA Pte Ltd
Industry Track 1:
Defense, Mobility and Transportation
Industry Track 2:
High-tech, Semiconductor and Electronics
13:45 - 14:05
Electrification and Autonomy in Mobility
Shitalkumar Joshi,
Senior Director, Ansys India-ASEAN
Multi-Chiplet Heterogeneous Integration
for AI System in Package

Dr. Surya Bhattacharya, Director,
System in Package (SiP),
A*Star Institute of Microelectronics (IME)
14:05 - 14:25
NTU Satellite Design with ANSYS Simulation
Lee Chon Kiat,
Mechanical Lead, NTU-SaRC
Designing Next Generation RF Devices
with Ansys Multiphysics Flow

Vamsi Krishna,
Director- Customer Excellence, Ansys
14:25 - 14:45
Digital Mission Engineering for
Multi-Domain Defense Systems

Karynna Tuan,
Manager Application Engineering, Ansys
Thermomechanical Reliability of Electronics
from 2.5D/3D-ICs to Systems

Bharat Panjawani,
Lead Application Engineer, Ansys
14:45 - 15:00
Tea/Coffee + Networking + Technology Showcase
15:00 - 15:20
Industry Presentation
Roshan Vijay, Head of Simulation-based
Testing, Validation and Research, CETRAN
Industry Presentation
15:20 - 15:35
Q&A
Q&A
15:35 - 15:40
Concluding Remarks
Concluding Remarks
15:40 - 16:00
Networking + Technology Showcase

*Limited Seats Available | Invitation-only event